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The process of mounting a semiconductor die to a substrate is known as die attach.
It is the process which usually takes place immediately prior to wire bonding, during monolithic integrated circuit (IC) or hybrid package manufacture.
TWI has been involved, for several years, in the research of wire bonding techniques, including the development of Al ball bonding. For such expertise in wire bonding to be exploited in automatic assembly, it is necessary for accurate positioning and attachment of the semiconductor dice and the substrate, between which wires form electronic connections.
Current automatic bonding machine software may be very sophisticated but, since tighter tolerances are imposed on such things as the alignment of bonding targets on the die and the substrate (especially for military applications), an increase of tolerances on die attachment becomes necessary.
