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00:01:05 1 Examples
00:03:03 2 Comparison to other deposition techniques
00:03:15 2.1 Advantages
00:04:06 2.2 Disadvantages
00:04:43 3 Applications
00:05:32 4 Decorative applications
00:06:21 5 See also
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Speaking Rate: 0.9146984017333656
Voice name: en-US-Wavenet-E
"I cannot teach anybody anything, I can only make them think."
- Socrates
SUMMARY
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Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. Examples include semiconductor devices such as thin film solar panels, aluminized PET film for food packaging and balloons, and titanium nitride coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools (mainly for scientific purposes) have been developed.The source material is unavoidably also deposited on most other surfaces interior to the vacuum chamber, including the fixturing used to hold the parts.
