Rated Capacity:MAX 5300W
Dimensions:L650*W630*H850mm
Rated Duty Cycle:50-100%
Net Weight:60kg
Gross Weight: 110KG (1 wooden box)
Package Size: 88*68*87cm
Usage: BGA Reballing ,repair motherboard
Available BGA Chip:Max 70*70mm Min 1*1 mm
Available PCB size:Max 410*380mm Min 10*10 mm
Temperature control: Hot Air +infrared
Feature: Semi-automatic Optical Align BGA Rework Station

www.zhiesync.com
E-mail: zhiesync@gmail.com
WhatsAPP:  +86-18665889453

свернуть