Corning Precision Glass Solutions introduces a new line of glass carriers optimized for fan-out processes, Corning Advanced Packaging Carriers. These carriers feature high stiffness and fine granularity of coefficients of thermal expansion (CTE), which help reduce customers’ challenge of in-process warp by up to 40%. Here we demonstrate the impact of warp on vacuum chucking performance to show why these glass carrier attributes matter in a typical semiconductor fab.
