Samtec delivers innovative connectivity solutions with small form factors, extreme data rates and density, and optimized signal integrity. Our products are ideal for meeting the challenges of AI/ML applications. Artificial intelligence and machine learning (AI/ML) data center implementations require new topologies with increased throughput, density, flexibility and scalability. To meet these challenges, Samtec offers a range of high-performance interconnects ideal for supporting next-generation AI/ML topologies via AI accelerators and domain specific architectures (DSAs). For the designer, Samtec offers full-system optimization support with industry-leading signal integrity design expertise; characterization and development boards; and online design and development tools. Explore the solutions below or download the Artificial Intelligence Solutions Guide to see how Samtec products can support your design. For more information on Samtec Solutions for Al/ML for Datacom Applications click here: [ Ссылка ]
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