Dan Burgess is a Fellow and Packaging Engineer at Boston Scientific. Additionally, he is Chairman, F02 Primary Barrier Packaging Committee – ASTM International. In this interview, Dan discusses how packaging proves to be critical in rapid development projects during COVID-19.
Jen Benolken, CPPL, MDM & Regulatory Specialist at DuPont™ Tyvek® Medical & Pharmaceutical Packaging, interviews Dan Burgess during this wide-ranging and insightful interview.
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