Ever since the launch of the iPhone X, Apple has used a double-stacked board to save more space. The disadvantage of such smart design is the increasing difficulties in board-level repairs. And now we share an easy and efficient solution for you to separate, re-ball, and restore the motherboard for iPhone X. This fundamental technique is very crucial for double-stacked board-level repairs. We hope you enjoy watching it.
Tools and materials used in this video:
Heating platform: [ Ссылка ]
Soldering iron: [ Ссылка ]
Hot air gun: [ Ссылка ]
Microscope: [ Ссылка ]
Motherboard fixture: [ Ссылка ]
Desoldering braid/Solder wick: [ Ссылка ]
Tweezers: [ Ссылка ]
Rosin
Cleanroom wipes
Soft brush: [ Ссылка ]
Solder flux
PCB cleaner
Questions are most welcome!
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HCQS Official Website: [ Ссылка ]
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