In this TechVentures video, Future Electronics’ Technical Marketing Engineer Lazina Rahman visited the NXP booth at Embedded World 2022 to explore an industry-first solution by NXP.
Lazina checked in with Max Palumbo, Product Marketing Specialist for NXP Semiconductors, to walk us through the full capabilities of the newly-launched IW612, an industry-first tri-radio SoC to run Wi-Fi 6, BLE 5.2 Audio and 802.15.4 Thread concurrently.
The NXP IW612 brings higher throughput, better network efficiency, lower latency and improved range over previous generation Wi-Fi standards.
The device includes a full-feature Wi-Fi subsystem powered by their 802.11ax (Wi-Fi 6) technology. The SoC integrates a Wi-Fi MAC and also includes baseband as well as direct-conversion radio with integrated PA, LNA and a transmit/receive switch which removes the need for an RF front-end module (FEMs). This significantly reduces costs and system complexity.
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