HDZ-CL4030 Inline PCBA laser cutting equipment is suitable for precision cutting and groove digging of materials such as FPCA, PCBA, flexible-rigid combined boards, cover films, and SIP packaged chips.
CO2 Laser, UV Laser, GREEN Laser or Fiber laser can be selected according to actual processing needs.
Can be integrated inline with SMT assembly line.
Features:
Utilizing independently developed control software, it offers functions such as multi-panel cutting, automatic focusing, and expansion-contraction compensation, achieving high-precision processing.
Employing a high-precision motion system, scanning mirrors, and a vision positioning system, it delivers superior processing accuracy (with an all-marble structure).
Adopting an inline loading and unloading method, it reduces downtime for loading and unloading, thereby enhancing production efficiency.
Contact us for more information,
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laser@hanslaser.com
(+1) 832-234-9188
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