To meet the exploding demand for data storage, KIOXIA developed the first ever 3D flash memory, BiCS FLASH™. This massive capacity of BiCS FLASH™ is made possible with KIOXIA batch processing technology.
KIOXIA’s 8th generation BiCS FLASH™ also relies on a new technology called CMOS Directly Bonded to Array (CBA), which consists of high-precision bonding of two wafers to improve memory density and performance.
