Our WaferMate Series Automated wafer handling platform delivers wafer handling for standard and non-standard wafers and substrates.

This automated wafer handling system was integrated with a DEK printer process tool and demonstrates the handling of 200mm warped wafers. It features an aligner station and transfer station with 6 lift pins designed for the handling of fragile warped wafers.

System Specs:
• 200mm (4mm thick) Wafers
• Transfer station to DEK Printer
• Pallet with 6 lift pins
• Aligner Station

Interested in learning more about our wafer handling capabilities?

Visit our website to learn more:
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Timeline:
0:00 Warped Semiconductor Wafer Handling System
0:07 Open Cassette Wafer Mapping
0:37 Vacuum Grip Aligner
1:11 Wafer Handoff to Process Tool
1:30 Wafer Loading into Output Cassette
1:51 Wafer Pickup from Aligner
1:55 Wafer Handoff to Process Tool
2:11 Wafer Pickup from Transfer Station
2:14 Wafer Loading into Output Cassette
2:26 Wafer Alignment Process
2:34 Wafer Pickup from Aligner
2:37 Wafer Handoff to Process Tool
2:53 Wafer Pickup from Transfer Station
2:56 Wafer Loading into Output Cassette

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