While visiting Lian Li's factories in Taiwan, we stopped by Lian Li HQ to look at a prototype airflow case, the Lancool II Mesh, which will be the successor to the Lancool II.
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Lian Li previously released the Lancool II toward end of year 2019, but we had issues with its thermal performance given the panel design. The company then brought a revision to CES, and since CES, has made even further revisions to increase hole density in the mesh of the Lancool II case update.
Our review of the original Lian Li Lancool II is here: [ Ссылка ]
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Video: Andrew Coleman, Keegan Gallick
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