Selective Soldering is a process to solder individual through hole components on a PCB using a solder fountain.

The solder fountain or head moves to the position to solder from underneath. 
Compared to manual soldering, this process is faster, repeatable and leads to a better result.
As always this technology has limitations.

We don’t use the selective soldering equipment when component leads are too long ( 2 mm or more), because the solder head stays too far from the pads, and a good solder joint is not guaranteed.
When there are components close to the point to be soldered, we risk damaging the component, or wash it off the board.
Compared to a solder wave selective soldering has some clear advantages.
Many components cannot be processed on wave soldering.
A selective soldering machine uses a head that moves to the point where solder needs to be applied, and leaves the rest of the board untouched.
Wave soldering works much faster, but the whole board is touched by high temperature molten solder.

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