Discover Henkel's high gap stability, thermally conductive gel solutions for telecom infrastructure applications. This heat dissipating gels once dispensed, hold their shape and are ideal for 5G infrastructure & other telecommunication applications. For details visit : [ Ссылка ]
The video features BERGQUIST Liqui Form® TLF 6000HG used for heat management in telecom’s remote Radiohead units. Liqui form material is easily compressed, optimizes heat dissipation by displacing air gaps, reduces stress on component & improve long term reliability by reducing heat. It prolongs the life expectancy and reliability of electronics
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