Join Cameron Brett of KIOXIA and the co-chair of the SNIA SSD Special Interest Group as he moderates a FMS 2020 panel session with Bill Lynn (Dell); Paul Kaler (HPE), and John Geldman (KIOXIA) on the new EDSFF form factors (such as E3.S).

These form factors allow higher system density and more effective forms for high-performance racks. They also provide a common connector for GPUs and advanced network interface cards. Builders of servers, all-flash arrays (AFAs), and storage appliances can use them to develop systems with unparalleled flexibility, allowing a single configuration to serve a variety of applications such as databases, AI, augmented and virtual reality, video and image processing, IoT, and cybersecurity. They can also handle PCIe 5.0, CXL, 100GbE, and other emerging interfaces. They offer higher power budgets and better signal integrity than the 2.5 form factors built to fit a widely used hard drive size. New development vehicles are also available to help designers implement their systems rapidly.
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