Liquid cooling has become essential as TDPs reach and exceed thousands of watts per chip.
Solutions Manager Mehnaz Mahbub discusses Supermicro's direct-to-chip liquid cooling solutions, including cold plates, cooling distribution units, and manifolds, all integrated as a rack-level solution. Each component is fully validated and tested at system, rack, and cluster levels, ensuring a seamless plug-and-play experience for our customers.
Join us at booth #2531 during SC24 to learn more about how Supermicro transforms AI infrastructure: [ Ссылка ]
