To meet the highest requirements, we have developed a new product line based on our proven and successful packaging systems Emba-Flex® (retention packaging) and Emba-Swing® (suspension packaging). The idea was to offer a perfect solution for e.g. dental technology applications, precision engineering applications and chip technology applications, where dust-free packaging systems are necessary. To a large extent, the use of plastic packaging material minimises the amount of fine particles usually present when using corrugated board packaging.

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