Visit: [ Ссылка ]. Semiconductor Equipment Corporation's New Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation.
The Eagle's base platform includes a retractable cube beam splitter viewing system with LED lighting, precision servo-driven Z motion with closed loop bond load control, closed loop temperature controls for head, stage and spot heating and Windows XP Pro operating system. Various standard heads and stages are available.
