This video presents how to inspect BGA bolb (bubble) on PCB mother board with our X Ray inspection machine X-5600.
More details, please feel free to contact us.
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We are the original manufacturer of this X-Ray machine.
The X-Ray inspection machines are widely used in the field :
1. BGA Solder Ball Bubble Caculation
2. IC Chips Inside Connector Wire Inspection
3. Inspect the Voids under Joint
4. PCB FPC Mobile Flex Cable Soldering Inspection
5. LED field
6. Battery, Connector, etc
7. Die Casting
